Taiwan Semiconductor Manufacturing Company (TSMC) invests $165 billion to speed up the construction of its wafer plant in Arizona, United States, to address potential US semiconductor tariffs.

TaiwanBusiness04/13 19:07
Taiwan Semiconductor Manufacturing Company (TSMC) invests $165 billion to speed up the construction of its wafer plant in Arizona, United States, to address potential US semiconductor tariffs.

TSMC is accelerating the construction of its third-phase semiconductor fabrication plant in Arizona in response to the potential imposition of tariffs on semiconductor products by the United States, increasing the total investment to $165 billion and advancing the groundbreaking to June 2025. U.S. Secretary of Commerce Lutnik stated that individual tariffs on semiconductor products are expected to be imposed within one to two months to encourage manufacturing to return to the U.S., prompting heightened alert and responsive measures within the industry.

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04/13 19:07

Taiwan Semiconductor Manufacturing Company (TSMC) invests $165 billion to speed up the construction of its wafer plant in Arizona, United States, to address potential US semiconductor tariffs.

TSMC is accelerating the construction of its third-phase semiconductor fabrication plant in Arizona in response to the potential imposition of tariffs on semiconductor products by the United States, increasing the total investment to $165 billion and advancing the groundbreaking to June 2025. U.S. Secretary of Commerce Lutnik stated that individual tariffs on semiconductor products are expected to be imposed within one to two months to encourage manufacturing to return to the U.S., prompting heightened alert and responsive measures within the industry.

TSMC's U.S. Expansion Plan Enters Acceleration Phase

Since TSMC announced in 2020 that it would establish its first wafer fab in Arizona, USA, it has increased its total investment in the area from the initial $12 billion to $16.5 billion, making it one of the largest foreign direct investments in U.S. history. According to supply chain sources, the third phase of the wafer fab (Fab 21p), originally scheduled to break ground in 2026, has been moved up to June 2025, with trial production expected in 2027, introducing advanced processes such as 2nm and A16.

Currently, the second phase of the wafer fab is undergoing cleanroom and electromechanical engineering construction, with trial production expected to begin by the end of 2026. After the third phase breaks ground, TSMC will immediately start building an advanced packaging plant, introducing technologies such as CoWoS and SoIC, further enhancing its manufacturing capabilities in the U.S. The supply chain indicates that TSMC has placed new equipment orders with Taiwanese packaging equipment suppliers like Grand Plastic, Scientech, and Marketech, requesting expedited shipments to the U.S.

Responding to Potential Tariff Pressure: Customers and Supply Chain Move in Sync

TSMC's accelerated plant construction is driven by pressure from major U.S. customers and increased policy risks. American tech giants like Apple, NVIDIA, AMD, and Qualcomm all hope their supply chains can increase U.S. manufacturing to mitigate the potential cost impact of tariffs.

Industry insiders reveal that TSMC has asked partners responsible for plant engineering, such as CTCI and L&K Engineering, to expedite the transportation and installation of infrastructure like cleanrooms and chemical pipelines, aiming to complete the plant's foundational engineering by the end of 2025 and immediately begin plant construction.

Additionally, TSMC's past strategy of "three wafer fabs paired with one advanced packaging plant" is also being followed in this U.S. expansion. The industry is optimistic that with the start of the advanced packaging plant, related equipment suppliers like Grand Plastic, Scientech, Marketech, and Kinik will benefit from TSMC's increased investment in the U.S.

U.S. Tariff Policy Shift: Semiconductors Take Center Stage

The U.S. government has recently made significant changes to its tariff policy on tech products. Although the U.S. Customs and Border Protection (CBP) announced on April 11 a temporary exemption for 20 categories of electronic products, including smartphones, laptops, and chips, U.S. Commerce Secretary Raimondo stated on April 13 that these exemptions are only "temporary" and will be included in the "semiconductor tariffs" category, expected to be implemented in one to two months.

Raimondo noted that these products will be classified as semiconductor-related items and subject to "special targeted tariffs" to encourage manufacturing to return to the U.S. She emphasized, "We need to manufacture chips, tablets, and other key tech products in the U.S. and can no longer rely on Southeast Asia."

According to White House officials, the Trump administration will invoke Section 232 of the Trade Expansion Act to launch a national security investigation into semiconductor imports, potentially imposing high tariffs. This section has been used to tax steel and automobiles and is highly enforceable.

Industry Simulates Three Major Tariff Scenarios

Facing the impending semiconductor tariffs, the industry has begun simulating possible taxation models:

  1. Reservoir Model: Tax based on the difference between a company's global capacity and U.S. domestic capacity. For example, TSMC's global annual capacity exceeds 16 million 12-inch wafers, while the U.S. plant initially only about 500,000 wafers. Taxing based on this difference could result in extremely high rates.

  2. Imported Chip Taxation: Directly taxing chips imported into the U.S., impacting EMS (Electronic Manufacturing Services) companies like Foxconn and Quanta, which need to import chips for assembly.

  3. Finished Product Chip Content Taxation: Taxing all end products containing semiconductor components, such as laptops, phones, and servers. This model covers a wide range but is challenging to implement and trace.

The industry generally believes that no matter which model is adopted, it will have a profound impact on the global semiconductor supply chain. TSMC's accelerated U.S. plant construction aims to gain a foothold before the policy takes effect, reducing potential future tax burdens.

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